Lead Free version of part # 8000-45
Lead Free version of part # 8000-45
High-temp laminate designed for higher lead free processing temperatures. 0.062" Thick. Board Dimensions 4" x 5" Gold-plated copper holes.
Lead Free version of part # 8000-45
High-temp laminate designed for higher lead free processing temperatures. 0.062" Thick. Board Dimensions 4" x 5" Gold-plated copper holes.
High-temp laminate designed for higher lead free processing temperatures. 0.062" Thick. Board Dimensions 4.5" x 6.5" Gold-plated copper holes.
Lead Free version of part # 8000-410
High-temp laminate for higher lead free processing temperatures. 0.062" Thick. Board Dimensions 4" x 10" Gold-plated copper holes.
Lead Free version of part # 8000-1010
Lead-free protoboard featuring a 0.1"x0.1" grid of plated through holes. High Temp Laminate (0.062"). Plated hole size = 37mils. Board Size:10"x10"
Lead Free version of part # 8100-45
Lead-free protoboard featuring a 0.1"x0.1" grid of plated through holes and one plane for power/ground. High Templ laminate(0.062"). Plated hole size = 37mils. Board Size:4"x5"
Lead Free version of part # 8200-45
High Temp laminate for higher lead free processing temperatures; 0.062" Thick. Board Dimensions 4" x 5". Planes on front and rear sides for power/ground. Gold-plated copper holes.
Lead Free SMT adapter with high-temp laminate and gold plating. Supports packages with SOIC Medium, Metric (50 mil Spacing) & Tiny (25 mil Spacing).
Lead Free - High temp laminate with gold plating. Supports TSSOP packages and other components (for example, SMT cable connectors) with 0.50mm Spacing (20 mil spacing).
Individiual traces extend every pin from SMT package to dedicated plated through holes. Additional plated holes provided for general prototyping.
Supports packages with 2.4mm (Min) to 10.6mm (Max) outside lead spacing measurement.
Ground plane on reverse side.