SMT 64 pin TQFP packages. Individiual traces extend every pin from SMT package to dedicated plated through holes, spaced on 0.1" x 0.1" centers. Additional plated holes provided for general prototyping.
0.50mm Spacing (20 mil spacing). Ground plane on reverse side.
QFP SMT Magic Pads: Pitch 0.5mm
Pin Count from 4 to 304, including 208 and 240 Pin QFP Devices.
0.50mm Spacing (20 mil spacing). Ground plane on reverse side.
Adapter ships with large selection of male and female 0.1" header posts for easy access to signals.
SMT 80 pin QFP packages. Individiual traces extend every pin from SMT package to dedicated plated through holes. Additional plated holes provided for general prototyping.
SMT TSSOP 0.50mm Spacing (20 mil spacing).
Individiual traces extend every pin from SMT package to dedicated plated through holes. Additional plated holes provided for general prototyping. Plated holes spaced on 0.1" x 0.1" centers
Supports packages with 2.4mm (Min) to 10.6mm (Max) outside lead spacing measurement.
Ground plane on reverse side.
Lead Free - High temp laminate with gold plating. Supports TSSOP packages and other components (for example, SMT cable connectors) with 0.50mm Spacing (20 mil spacing).
Individiual traces extend every pin from SMT package to dedicated plated through holes. Additional plated holes provided for general prototyping. Plated holes spaced on 0.1" x 0.1" centers
Supports packages with 2.4mm (Min) to 10.6mm (Max) outside lead spacing measurement.
Ground plane on reverse side.
SMT Adapter for TSOP 40, 48 & 56 (20 mil Spacing), PSOP 44 (50 mil Spacing) & SSOP 56 (30 mil Spacing).
SMT adapters for SOIC Medium, Metric (50 mil Spacing) & Tiny (25 mil Spacing).
Individiual traces extend every pin from SMT package to dedicated plated through holes. Additional plated holes provided for general prototyping. Plated holes spaced on 0.1" x 0.1" centers
Ground plane on reverse side.
Lead Free SMT adapter with high-temp laminate and gold plating. Supports packages with SOIC Medium, Metric (50 mil Spacing) & Tiny (25 mil Spacing).
Individiual traces extend every pin from SMT package to dedicated plated through holes. Additional plated holes provided for general prototyping. Plated holes spaced on 0.1" x 0.1" centers
Ground plane on reverse side.
SMT Adapters for QFP 240 & 208, +TQFP 144, 128 & 100
SMT Adapters for QFP 44, 100 & 160 pin packages.
Pad to Pad Spacing: 25mil
Plated holes spaced on 0.1" x 0.1" grid
Quad Flat Pack (QFP) Package 208 SMT adapter extends the signals of the package to plated through holes on a 100 mil grid.
Ground plane on solder side.
SOIC medium, wide, metric and plastic miniflat package SMT adapter extends the signals of the packages to plated through holes on a 100 mil grid.
Ground plane on solder side.
Pad to Pad Spacing: 50 mil
PLCC 20, 28, 44, 64 and 84 pin package SMT adapter extends the signals of the packages to plated through holes on a 100 mil grid.
Ground plane on solder side.
Pad to Pad Spacing: 50 mil
SMT adapters extend the signals of the following packages to plated through holes on a 100 mil grid: Quad Flat Pack (QFP) Packages 144, 128, 100-3, 100-2, 80-3, 74, 64-4, 64-1, 52, 48,44-2
Pad to Pad Spacing: 20mil (100-2, 100-3, 144)
Pad to Pad Spacing: 25mil (44-2, 48, 64-1, 80-3, 128)
Pad to Pad Spacing: 30mil (52, 64-4, 74)
Ground plane on solder side.
SMT adapters extend the signals of the following packages to plated through holes on a 100 mil grid: 20, 28, 44, 68 or 84 Pin PLCC Packages (6) Narrow and wide SOIC packages.
80 and 100 pin controller packages.
Ground plane on solder side.
BGA-256-1.0mm
Surface mount BGA adapter.
Designed for BGA 256 components.
1mm pitch.
All pads break out to dedicated plated through holes.
BGA-256-1.27mm
Surface mount BGA adapter.
Designed for BGA 256 components.
1.27mm pitch.
All pads break out to dedicated plated through holes.