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PCI Express 3.0 FPGA Development Board - Xilinx Virtex Ultrascale+ (VU5P)


PCI Express 3.0 Development Board 

This PCI Express design kit is based on a market leading FPGA technology (Xilinx Virtex Ultrascale+ VU5P)

Key features and benefits include:

  • PCIe Gen3 x16
  • Supports PCIe x16 (Gen 1, 2, or 3)
  • 2 banks of DDR4 memories
  • 2 banks of QDR2+ memories
  • Dual QSFP28 cages 10GbE/40GbE/100GbE networking solutions

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Xilinx Boards

PCI Express 3.0 FPGA Development Board - Xilinx Virtex Ultrascale+ (VU9P)


PCI Express 3.0 Development Board 

This PCI Express design kit is based on a market leading FPGA technology (Xilinx Virtex Ultrascale+ VU9P)

Key features and benefits include:

  • PCI Express 3.0 compliantGHz
  • Supports PCIe x16 (Gen 1, 2, or 3)
  • 2 banks of DDR4 memories
  • 2 banks of QDR2+ memories
  • Dual QSFP28 cages 10GbE/40GbE/100GbE networking solutions

ADDITIONAL TECHNICAL INFORMATION OR TO PLACE AN ORDER:
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Xilinx Boards

Zeus Zynq UltraScale+ MPSoC System-on-Module


Based on Xilinx Zynq-UltraScale+ (XCZU11EG-1FFVC1760I) device

Programmable Logic 650 KLE

Block RAM 21.1MB, UltraRAM 22.5Mb, 2928 DSP Slices

FPGA spped grad 1, industrial temp range

Quad-core ARM Cortex-A53 MBCore @ 1.2GHz

Dual-core ARM Cortex-R5 MPCore @ 500MHz

Mali 400 MP2 @ 600MZ

 

Key features and benefits include:

    • PCIe Gen2 x4 Root Complex
    • PCIe Gen3 x16 End Point
    • 304 SE IOs total (96 LVDS)
    • 3x DDR4 banks, 16GByte Total
Applications:
    • Software Defined Radio
    • Radar Systems
    • Electronic Warfare
    • High Precision Measurement
    • Customizable to user specifcations

 

 

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Xilinx Boards

Carrier Board for Zeus System on Module


Carrier board for Zeus SoM

The carrier board provides expansion capabilities for the Zeus Zynq UltraScale+ System on Module. Board Dimensions: 170mm x  233.35mm.

Key features and benefits include:

  • Dual FMC+ connectors; FMC+ HPC: 16 transceivers @ 12.5Gpbs, 58x LVDS, 44x SE and FMC+ LPC: 16 transceivers @ 12.5 Gbps, 34x LVDS
  • PS Interfaces:  1x GbE, 2x USB 2.0 Type A and USB 3.1 Type C.
  • Includes power supply and cables
  • Includes starter guide, reference manual, and test designs
 

ADDITIONAL TECHNICAL INFORMATION OR TO PLACE AN ORDER:

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Xilinx Boards

PCI Express 3.0 FPGA Low Profile Development Board


PCI Express 3.0 Development Board

The XpressV7-LP HE FPGA design kit provides a complete design environment for applications using PCIe and 10GbE as their main communication interfaces. The XpressV7-LP HE is a highly integrated low-profile PCI Express FPGA card with quad-10Gb Ethernet (40GbE) engineered for both prototyping and field deployment. This PCI Express design kit is based on a market leading FPGA technology (Xilinx Virtex 7 - VX690)

Key features and benefits include:

  • PCI Express 3.0/1.1
  • Quad-10GbE over QSFP+
  • No external power supply required
  • Supports PCIe 3.0, 2.0 and 1.1 (x1,x2, x4, and x8)
  • 2 x 4Gb DDR3 SDRAM, 800Mhz, 72-bit datapath with ECC
  • 256MB Flash Memory
  • Optional daughter cards available

 

ADDITIONAL TECHNICAL INFORMATION OR TO PLACE AN ORDER:

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Xilinx Boards

PCI Express 2.0 FPGA Development Board - EOL - see alternate part numbers


PCI Express 2.0 Development Board

The XpressK7 FPGA design kit provides a complete design environment for applications using PCIe. The XpressK7 is a highly integrated PCI Express FPGA card engineered for both prototyping and field deployment. This PCI Express design kit is based on a market leading FPGA technology (Xilinx Kintex-7 - 160T and 325T versions)

 

 

NOTE: XpressK7 is  EOL.  See XpressVUP-LP5PT for suggested replacement

Contact sales@twinind.com for additional information.

 


EOL - see alternate part numbers

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